HEAT-CURABLE RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION AND SEMICONDUCTOR DEVICE

• Main Authors: KUSHIHARA NAOYUKI, KAWAMURA NORIFUMI, KUDO YUKI, TSUTSUMI YOSHIHIRO
• Format: Patent
• Language: English; Korean
• Published: 19.02.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

A purpose of the present invention is to provide: a thermosetting resin composition for semiconductor encapsulation which produces a cured product having excellent tracking resistance and dielectric properties, and having good continuous moldability; and a semiconductor device encapsulated with the cured product of the resin composition. The thermosetting resin composition for semiconductor encapsulation contains components (A) to (E), which are; (A) an epoxy resin which is solid at 25°C other than a silicone-modified epoxy resin; (B) the silicone-modified epoxy resin; (C) a cyclic imide compound containing at least one dimer acid skeleton, at least one straight chain alkylene group having 6 or more carbon atoms, at least one alkyl group having 6 or more carbon atoms, and at least two cyclic imide groups in molecules; (D) an inorganic filler; and (E) an anionic curing accelerator. [과제] 내트래킹성과 유전 특성이 우수한 경화물을 생산하고, 연속 성형성이 양호한 반도체 밀봉용 열경화성 수지 조성물 및 그 수지 조성물의 경화물로 밀봉된 반도체 장치의 제공. [해결 수단] 하기 성분 (A) 내지 (E)를 포함하는 반도체 밀봉용 열경화성 수지 조성물. (A) 실리콘 변성 에폭시 수지 이외의 25℃에서 고체인 에폭시 수지 (B) 실리콘 변성 에폭시 수지 (C) 분자 중에 적어도 하나의 다이머산 골격, 적어도 하나의 탄소수 6 이상의 직쇄 알킬렌기, 적어도 하나의 탄소수 6 이상의 알킬기, 및 적어도 2개의 환상 이미드기를 함유하는 환상 이미드 화합물 (D) 무기 충전재 (E) 음이온계 경화 촉진제