라미네이션 공정

실리콘계 라미네이션 접착제 조성물, 특히 실온에서 또는 실온 주위에서 경화되는 것들을 위한 라미네이션 공정. A lamination process is disclosed. The process is useful for silicone based lamination adhesive compositions, in particular those which cure at or around room temperature....

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Bibliographic Details
Main Authors GUBBELS FREDERIC, BAILY VICTOR, CHAMBARD GREGORY, BEAUCARNE GUY
Format Patent
LanguageKorean
Published 14.01.2020
Subjects
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
TRANSPORTING
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Summary:실리콘계 라미네이션 접착제 조성물, 특히 실온에서 또는 실온 주위에서 경화되는 것들을 위한 라미네이션 공정. A lamination process is disclosed. The process is useful for silicone based lamination adhesive compositions, in particular those which cure at or around room temperature.
Bibliography:Application Number: KR20197034723