접착제 조성물 및 접속체의 제조 방법

• Main Authors: MATSUZAWA MITSUHARU, MATSUDA KAZUYA, KAWABATA YASUNORI, IIJIMA YUUSUKE, SHINOHARA KENGO
• Format: Patent
• Language: Korean
• Published: 08.01.2020
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; CONDUCTORS; CURRENT COLLECTORS; DYES; ELECTRICITY; INSULATORS; LINE CONNECTORS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; USE OF MATERIALS AS ADHESIVES

본 발명의 일측면은, 접착제 성분과 도전성 입자를 함유하고, 도전성 입자가 플라스틱 입자 및 해당 플라스틱 입자를 피복하는 금속층을 갖고, 도전성 입자의 표면에는 복수의 돌기부가 형성되어 있고, 복수의 돌기부의 높이가 평균으로 85 내지 1200nm인 접착제 조성물이다. An aspect of the present invention relates to an adhesive composition which comprises an adhesive component and electroconductive particles, wherein the electroconductive particles each comprise a plastic particle and a metal layer covering the plastic particle and have a plurality of projections formed on the surface thereof, the plurality of projections having an average height of 85-1,200 nm.