FORMING NITROGEN-CONTAINING LAYERS AS OXIDATION BLOCKING LAYERS
The present invention relates to a method for forming a nitrogen-containing layer as an antioxidant layer. The method for forming a nitrogen-containing layer as an antioxidant layer comprises the steps of: forming a silicon layer on a wafer; forming an oxide layer being in contact with the silicon l...
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Main Authors | , |
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Format | Patent |
Language | English Korean |
Published |
08.01.2020
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention relates to a method for forming a nitrogen-containing layer as an antioxidant layer. The method for forming a nitrogen-containing layer as an antioxidant layer comprises the steps of: forming a silicon layer on a wafer; forming an oxide layer being in contact with the silicon layer; and annealing the wafer at an atmosphere containing ammonia (NH_3) to form a dielectric barrier layer being in contact with the silicon layer and the oxide layer between the silicon layer and the oxide layer after the oxide layer is formed, wherein the dielectric barrier layer includes silicon and nitrogen.
방법은 웨이퍼 상에 실리콘층을 형성하는 단계와, 상기 실리콘층과 접촉하는 산화물층을 형성하는 단계와, 상기 산화물층이 형성된 후에, 암모니아(NH)를 포함하는 분위기에서 상기 웨이퍼를 어닐링하여 상기 실리콘층과 상기 산화물층 사이에, 상기 실리콘층 및 상기 산화물층과 접촉하는 유전체 배리어층을 형성하는 단계를 포함한다. 유전체 배리어층은 실리콘 및 질소를 포함한다. |
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Bibliography: | Application Number: KR20180153689 |