필름 및 필름의 제조 방법

• Main Authors: SHOJI HIDEO, TANAKA TERUYA, MANABE ISAO
• Format: Patent
• Language: Korean
• Published: 17.12.2019
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; WORKING-UP

25℃에서의 5％ 신장시 응력 Ta가, 1.0MPa 이상 20.0MPa 이하이고, 120g/mm의 하중을 가하여, 25℃부터 160℃까지 승온 속도 10℃/분으로 승온했을 때의 90℃에서의 치수 변화율을 90℃ 치수 변화율 1, 90℃ 치수 변화율 1이 최대가 되는 방향을 X 방향, X 방향과 필름면 내에서 직교하는 방향을 Y 방향, X 방향의 90℃ 치수 변화율을 Tx1(％)이라 했을 때에, Tx1이 -10.00％ 이상 10.00％ 이하인 것을 특징으로 하는 필름. 가열 공정에 있어서 평면성을 유지할 수 있을 정도의 내열성, 및 다이싱용 점착 필름 등으로서 사용하기에 충분한 유연성을 구비하는, 반도체 제조 공정용 기재로서 적합한 필름을 제공한다. A film characterized by having a stress at 5% elongation at 25°C, Ta, of 1.0-20.0 MPa. In cases when dimensional change at 90°C during heating from 25°C to 160°C at a rate of 10 °C/min under a load of 120 g/mm2 is referred to as 90°C dimensional change 1 and when the direction in which the 90°C dimensional change 1 is maximum is referred to as X direction, the direction which is perpendicular to the X direction within the plane of the film is referred to as Y direction, and the X-direction 90°C dimensional change is expressed by T×1 (%), then the film is characterized in that T×1 is -10.00% or greater but not greater than 10.00%. The film has both heat resistance sufficient for maintaining the flatness in heating steps and flexibility sufficient for uses as a dicing pressure-sensitive adhesive film, etc., and is suitable for use as a substrate for semiconductor production steps.