SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

• Main Authors: ASOU YUTAKA, SADA TETSUYA
• Format: Patent
• Language: English; Korean
• Published: 10.12.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Provided is technology for increasing uniformity of substrate temperature by heat treatment. According to an embodiment, a substrate processing apparatus includes a conveying mechanism, a first heat treatment part, a second heat treatment part, and a ventilation mechanism. The conveying mechanism conveys a substrate in a flat flowing manner. The first heat treatment part performs heat treatment with respect to the substrate conveyed in the flat flowing manner. The second heat treatment part is continuously formed in the first heat treatment part, and, with respect to the substrate heat-treated by the first heat treatment part, performs heat treatment at temperature lower than that of the first heat treatment part. The ventilation mechanism performs ventilation from an upper area of the first heat treatment part so that air can flow from an upstream side of a conveying direction of the substrate compared to the first heat treatment part and a second heat treatment part side to the inside of the first heat treatment part. [과제] 열 처리에 의한 기판 온도의 균일성을 향상시키는 기술을 제공한다. [해결수단] 실시형태에 따른 기판 처리 장치는, 반송 기구와, 제1 열 처리부와, 제2 열 처리부와, 배기 기구를 포함한다. 반송 기구는, 기판을 평류(flat flowing) 반송한다. 제1 열 처리부는, 평류 반송되는 기판에 대하여 열 처리를 행한다. 제2 열 처리부는, 제1 열 처리부에 연속하여 마련되며, 제1 열 처리부에 의해 열 처리된 기판에 대하여, 제1 열 처리부보다 낮은 온도로 열 처리를 행한다. 배기 기구는, 제1 열 처리부보다 기판의 반송 방향의 상류측 및 제2 열 처리부측으로부터 제1 열 처리부 내로 공기가 흐르도록, 제1 열 처리부의 상방으로부터 배기한다.