APPARATUS FOR CUTTING SUBSTRATE

According to an embodiment of the present invention, a substrate cutting apparatus includes: a scribing unit forming a scribing line on a substrate; a transfer unit on which the substrate is mounted and which has a support belt moving in a transfer direction of the substrate so as to transfer the su...

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Bibliographic Details
Main Authors PARK JI WOONG, PARK SANG DEUK, JUNG HA JIN, PARK SOO HOON
Format Patent
LanguageEnglish
Korean
Published 04.12.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:According to an embodiment of the present invention, a substrate cutting apparatus includes: a scribing unit forming a scribing line on a substrate; a transfer unit on which the substrate is mounted and which has a support belt moving in a transfer direction of the substrate so as to transfer the substrate to the scribing unit; and a belt maintaining unit grasping both ends of the support belt in a direction crossing over the transfer direction of the substrate and moving in the transfer direction of the substrate along with the support belt. 본 발명의 실시예에 따른 기판 절단 장치는, 기판에 스크라이빙 라인을 형성하는 스크라이빙 유닛; 기판이 안착되며, 기판을 스크라이빙 유닛으로 이송하도록 기판의 이송 방향으로 이동하는 지지 벨트를 포함하는 이송 유닛; 및 기판의 이송 방향에 직교하는 방향으로의 지지 벨트의 양단을 파지하여 지지 벨트와 함께 기판의 이송 방향으로 이동하는 벨트 유지 유닛을 포함할 수 있다.
Bibliography:Application Number: KR20180059110