LED MODULE FOR VEHICLES

The present invention provides a vehicle LED module which insert-molds a ceramic printed circuit board having an LED package mounted thereon into engineering plastic so as to minimize manufacturing costs and manufacturing processes while maintaining heat dissipation efficiency. The vehicle LED modul...

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Bibliographic Details
Main Authors BANG YEUN HO, PARK SEUNG GON
Format Patent
LanguageEnglish
Korean
Published 04.12.2019
Subjects
BASIC ELECTRIC ELEMENTS
BLASTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEATING
LIGHTING
MECHANICAL ENGINEERING
NON-PORTABLE LIGHTING DEVICES
SEMICONDUCTOR DEVICES
SYSTEMS THEREOF
VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS
WEAPONS
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Summary:The present invention provides a vehicle LED module which insert-molds a ceramic printed circuit board having an LED package mounted thereon into engineering plastic so as to minimize manufacturing costs and manufacturing processes while maintaining heat dissipation efficiency. The vehicle LED module comprises: a ceramic printed circuit board having an LED package mounted thereon; and a housing arranged outside the LED package and the ceramic printed circuit board. The housing is formed by insert-molding the ceramic printed circuit board into an engineering plastic material. 엘이디 패키지가 실장된 세라믹 인쇄회로기판을 엔지니어링 플라스틱으로 인서트 사출하여 방열 효율을 유지하면서 제조 비용 및 제조 공정을 최소화하도록 한 차량용 엘이디 모듈을 제시한다. 제시된 차량용 엘이디 모듈은 엘이디 패키지가 실장된 세라믹 인쇄회로기판과, 엘이디 패키지 및 세라믹 인쇄회로기판의 외부에 배치된 하우징을 포함하고, 하우징은 세라믹 인쇄회로기판을 엔지니어링 플라스틱 소재로 인서트 사출하여 형성된다.
Bibliography:Application Number: KR20180059104