무전해 구리 도금용의 구리 콜로이드 촉매액, 무전해 구리 도금 방법, 및 구리 도금 기판의 제조방법

• Main Authors: TANAKA KAORU, YOSHIZAWA AKIHIRO, UCHIDA EI, KIMURA YUSUKE
• Format: Patent
• Language: Korean
• Published: 03.12.2019
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

계면활성제의 함유액에 비도전성 기판을 접촉시켜서 흡착 촉진 처리(전처리)를 한 뒤, 가용성 구리염(A); 환원제(B); 콜로이드 안정제(C); 수크로스, 트레할로오스 등의 비환원성 올리고당(D)을 함유하는 무전해 구리 도금용의 구리 콜로이드 촉매액으로 비도전성 기판에 촉매를 부여하고, 무전해 구리 도금을 하는 것을 통하여, 촉매액의 시간 안정성과 촉매 활성의 지속성이 모두 현저하게 향상됨과 함께, 흡착 촉진 처리(전처리)로 촉매 활성을 증가시킨 뒤에 촉매를 부여하고, 무전해 구리 도금을 하기 때문에, 석출하는 구리 피막의 외관이 우수하다. According to the present invention, the temporal stability and the sustainability of catalyst activity of a catalyst liquid are both significantly improved since electroless copper plating is performed by subjecting a non-conductive substrate to an adsorption acceleration treatment (pretreatment) by bringing the non-conductive substrate into contact with a surfactant-containing liquid, and by applying a catalyst to the non-conductive substrate using a copper colloidal catalyst liquid that is for electroless copper plating and that contains (A) a soluble copper salt, (B) a reducing agent, (C) a colloidal stabilizer, and (D) a non-reducing oligosaccharide such as sucrose and trehalose. In addition, a deposited copper coating membrane will have excellent appearance since electroless copper plating is performed by applying a catalyst after the catalyst activity thereof is enhanced by the adsorption acceleration treatment (pretreatment).