IC Resin composition for printed circuit board and IC package and product using the same

• Main Authors: LEE HWAYOUNG, SHIM JIHYE, JUNG HYUNG MI, KIM KISEOK
• Format: Patent
• Language: English; Korean
• Published: 20.11.2019
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The present invention relates to a resin composition for a printed circuit board and an IC package, and a product using the same. According to an embodiment, it is possible to provide the resin composition for the printed circuit board and/or the IC package with a low moisture absorption rate, thereby having excellent reliability, and having improved thermal stability and mechanical strength. 본 발명은 인쇄회로기판 및 IC 패키지용 수지 조성물 및 이를 이용한 제품에 관한 것이다.