수지 재료, 적층 필름 및 다층 프린트 배선판

• Main Authors: BABA SUSUMU, HAYASHI TATSUSHI, NISHIMURA TAKASHI
• Format: Patent
• Language: Korean
• Published: 30.10.2019
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

블리스터의 발생을 억제할 수 있고, 또한 보존 안정성이 우수하므로, 보존 후에도 구멍 또는 요철 표면에 대한 매립성을 양호하게 할 수 있는 수지 재료를 제공한다. 본 발명에 따른 수지 재료는 에폭시 화합물과 경화제와 실리카를 포함하고, 상기 경화제가 시아네이트에스테르 화합물과 카르보디이미드 화합물을 포함한다. Provided is a resin material that is capable of suppressing blister formation, and also exhibits superior storage stability, thereby allowing for good embeddability in holes or raised-and-recessed surfaces even after storage. The resin material according to the present invention contains an epoxy compound, a curing agent, and silica, the curing agent containing a cyanate ester compound and a carbodiimide compound.