CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE CHIP ON FILM PACKAGE

• Main Authors: NAM KI SOO, KANG GI YOUNG
• Format: Patent
• Language: English; Korean
• Published: 28.10.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A chip on film package includes a base substrate having an output pad region, a plurality of output pads disposed in the output pad region on the base substrate and arranged alternately in a zigzag on the plane of the base substrate, a plurality of output pad wires respectively connected to the outp...