INFRARED DETECTION SENSOR MODULE

According to an embodiment, an infrared sensing sensor module includes: a lower layer; a plurality of infrared detection sensors arranged in an array form on the lower layer; an upper layer having a plurality of cavities formed on the plurality of infrared detection sensors; a bonding layer bonding...

Full description

Saved in:
Bibliographic Details
Main Authors HWANG DEOK KI, PARK SOO YOUN
Format Patent
LanguageEnglish
Korean
Published 21.10.2019
Subjects
COLORIMETRY
MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT
MEASURING
PHYSICS
RADIATION PYROMETRY
TESTING
Online AccessGet full text

Cover

More Information
Summary:According to an embodiment, an infrared sensing sensor module includes: a lower layer; a plurality of infrared detection sensors arranged in an array form on the lower layer; an upper layer having a plurality of cavities formed on the plurality of infrared detection sensors; a bonding layer bonding the lower layer and the upper layer to each other; and a condenser lens formed on the upper layer. The bonding layer may be disposed between the plurality of infrared detection sensors and at the edges of the plurality of infrared detection sensors. It is possible to provide an infrared sensor module without using expensive vacuum equipment. 일 실시 예에 의한 적외선 감지 센서 모듈은 하부층; 상기 하부층 위에 어레이 형태로 배열된 복수의 적외선 감지 센서; 상기 복수의 적외선 감지 센서 상에 복수의 캐비티(cavity)가 형성된 상부층; 상기 하부층과 상기 상부층을 접합시키는 접합층; 및 상기 상부층 상에 형성되는 집광 렌즈를 포함하고, 상기 접합층은 상기 복수의 적외선 감지 센서들 사이 및 상기 복수의 적외선 감지 센서 가장 자리에 배치될 수 있다.
Bibliography:Application Number: KR20180042237