수지 재료 및 적층체

• Main Authors: SUGIMOTO MASATAKA, OOWASHI KEIGO, KAWAHARA YUKO, ASHIBA KOUJI
• Format: Patent
• Language: Korean
• Published: 01.10.2019
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; COMPOUNDS THEREOF; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; INORGANIC CHEMISTRY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; NON-METALLIC ELEMENTS; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

절연성 및 장기 신뢰성을 효과적으로 높일 수 있고, 절연 파괴 강도의 변동을 효과적으로 억제할 수 있고, 또한 접착성을 효과적으로 높일 수 있는 수지 재료를 제공한다. 본 발명에 따른 수지 재료는, 제1 질화붕소 응집 입자와, 제2 질화붕소 응집 입자와, 결합제 수지를 포함하고, 상기 제1 질화붕소 응집 입자의 공극률이 30％ 미만이고, 상기 제2 질화붕소 응집 입자의 공극률이 30％ 이상이며, 상기 제1 질화붕소 응집 입자를 구성하는 1차 입자의 애스펙트비와 상기 제2 질화붕소 응집 입자를 구성하는 1차 입자의 애스펙트비가 각각 7 이하이다. Provided is a resin material capable of effectively improving the insulating properties and the long-term reliability, effectively controlling the variation in dielectric breakdown strength, and effectively increasing the adhesion. A resin material according to the present invention includes first boron nitride aggregate particles, second boron nitride aggregate particles, and a binder resin, and the first boron nitride aggregate particles have a porosity of less than 30%, the second boron nitride aggregate particles have a porosity of 30% or more, and each of an aspect ratio of primary particles constituting the first boron nitride aggregate particles, and an aspect ratio of primary particles constituting the second boron nitride aggregate particles is 7 or less.