METHOD OF STICTION PREVENTION BY PATTERNED ANTI-STICTION LAYER
The present disclosure relates to a MEMS device having a patterned adhesion prevention layer and an associated forming method. The MEMS device has a handle substrate defining a first bonding surface, and a MEMS substrate having the MEMS device and defining a second bonding surface. The handle substr...
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Main Authors | , , , |
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Format | Patent |
Language | English Korean |
Published |
26.09.2019
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Subjects | |
Online Access | Get full text |
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