METHOD OF STICTION PREVENTION BY PATTERNED ANTI-STICTION LAYER

The present disclosure relates to a MEMS device having a patterned adhesion prevention layer and an associated forming method. The MEMS device has a handle substrate defining a first bonding surface, and a MEMS substrate having the MEMS device and defining a second bonding surface. The handle substr...

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Bibliographic Details
Main Authors CHANG KUEI SUNG, HSIEH CHENG YU, TSAI SHANG YING, LAI FEI LUNG
Format Patent
LanguageEnglish
Korean
Published 26.09.2019
Subjects
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