METHOD OF STICTION PREVENTION BY PATTERNED ANTI-STICTION LAYER

The present disclosure relates to a MEMS device having a patterned adhesion prevention layer and an associated forming method. The MEMS device has a handle substrate defining a first bonding surface, and a MEMS substrate having the MEMS device and defining a second bonding surface. The handle substr...

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Bibliographic Details
Main Authors CHANG KUEI SUNG, HSIEH CHENG YU, TSAI SHANG YING, LAI FEI LUNG
Format Patent
LanguageEnglish
Korean
Published 26.09.2019
Subjects
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
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Summary:The present disclosure relates to a MEMS device having a patterned adhesion prevention layer and an associated forming method. The MEMS device has a handle substrate defining a first bonding surface, and a MEMS substrate having the MEMS device and defining a second bonding surface. The handle substrate is bonded to the MEMS substrate through a bonding interface with the first bonding surface facing the second bonding surface. The adhesion prevention layer is arranged between the first bonding surface and the second bonding surface without being resided on the bonding interface. 본 개시는 패터닝된 점착방지층을 갖는 MEMS 장치 및 연관된 형성 방법에 관한 것이다. MEMS 장치는 제 1 본딩면을 규정하는 핸들 기판, 및 MEMS 디바이스를 갖고 제 2 본딩면을 규정하는 MEMS 기판을 갖는다. 핸들 기판은 제 1 본딩면이 제 2 본딩면을 향하는 상태에서 본딩 계면을 통해 MEMS 기판에 본딩된다. 점착방지층은 본딩 계면 위에는 상주하지 않고 제 1 본딩면과 제 2 본딩면 사이에 배열된다.
Bibliography:Application Number: KR20190114946