기판-바이어스된 원자층 증착을 위한 향상된 전기적 절연을 가진 척 시스템 및 방법

• Main Authors: SERSHEN MICHAEL J, BERTUCH ADAM
• Format: Patent
• Language: Korean
• Published: 05.09.2019
• Subjects: ADDITIVE MANUFACTURING TECHNOLOGY; ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; PERFORMING OPERATIONS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TRANSPORTING

기판 위에 도전성 박막을 형성하는 기판-바이어스된 원자층 증착 공정을 수행하기 위한 척 시스템은 기판을 지지하도록 구성된 도전성 기판 홀더 및 기판 홀더를지지하는 도전성 기부를 포함한다. 기판 홀더와 기부 사이에 전기 절연 층이 끼워진다. 전기 절연 층은 외측 에지와, 이 외측 에지에 형성되고 이 외측 에지 둘레에서 연속되는 에지 리세스를 갖는다. 에지 리세스는 도전성 박막이 에지 리세스의 전체 내부를 코팅하는 것을 방지하여 기판 홀더와 기부 사이의 전기적 절연을 유지하도록 구성된다. A chuck system for performing a substrate-biased atomic layer deposition process that forms an electrically conductive film on a substrate includes an electrically conductive substrate holder configured to support the substrate and an electrically conductive base that supports the substrate holder. An electrical isolating layer is sandwiched between the substrate holder and the base. The electrical isolating layer has an outer end and an edge recess formed in and that runs around the outer edge. The edge recess is configured to prevent the electrically conductive film from coating the entire interior of the edge recess, thereby maintaining electrical isolation between the substrate holder and the base.