EPOXY RESIN COMPOSITION FOR MOLDING SEMICONDUCTOR MOLDING FILM AND SEMICONDUCTOR PACKAGE USING THE SAME

• Main Authors: CHOI, BYUNG JU, JEONG, MIN SU, KYUNG, YOU JIN, LEE, KWANG JOO
• Format: Patent
• Language: English; Korean
• Published: 05.09.2019
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

The present invention relates to an epoxy resin composition for molding a semiconductor used as a molding material for large area wafer/panel processes by having excellent handling properties while showing improved bending properties and adhesive force and excellent molding properties, and a molding film and a semiconductor package using the epoxy resin composition for molding a semiconductor. To this end, the epoxy resin composition for molding a semiconductor comprises: an epoxy resin including a silane modified epoxy resin; a liquid superplasticizer including a reactive functional group; a curing agent; and a filler. 본 발명은 향상된 휨 특성과 접착력 및 우수한 몰딩 특성을 나타내면서, 취급성이 우수하여 대면적 웨이퍼/패널 공정용 몰딩 소재로 사용 가능한 반도체 몰딩용 에폭시 수지 조성물 및 이러한 반도체 몰딩용 에폭시 수지 조성물을 이용한 몰딩 필름 및 반도체 패키지에 관한 것이다.