열특성 평가 측정장치 및 이것을 이용한 열특성의 평가 측정방법

• Main Authors: MORI KUNIO, BESSHO TAKESHI, KIMURA NOBUMASA
• Format: Patent
• Language: Korean
• Published: 04.09.2019
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; TESTING; TESTING STATIC OR DYNAMIC BALANCE OF MACHINES ORSTRUCTURES; TESTING STRUCTURES OR APPARATUS NOT OTHERWISE PROVIDED FOR

일방향 열유속 정상비교법에 의해, 측정 대상물의 접촉 열저항값, 열저항값 및 열전도율을 측정할 수 있고, 측정 대상물의 면압 의존성, 열접촉 방법, 열이동 촉진 효과에 의해서 적절한 열측정 해석 기술에 적용할 수 있고, 신뢰성이 높은 열특성 평가 측정장치를 제공한다. 열특성 평가 측정장치(1)는, 측정 시료부(5)에의 열을 검지하는 열 센서(4g, 4g)를 갖고 측정 시료부(5)를 가열하는 열발생원부(4)와, 측정 시료부(5)와, 측정 시료부(5)로부터의 열을 검지하는 열 센서(6c, 6c)를 갖고 측정 시료부(5)를 냉각시키는 열냉각원부(6)가 순차 적층된 열특성 평가 측정장치로서, 측정 시료부(5)가, 열특성 평가 측정 대상물(5b)과 이것을 사이에 삽입하고 있는 열전도재(5a, 5c)의 3층 구조체를 구비하고, 열전도재(5a, 5c)와 열발생원부(4) 및 열냉각원부(6)가 열이동촉진제를 개재해서 밀착되고, 열특성 평가 측정 대상물(5b)과 열전도재(5a, 5c)가 물리접촉, 화학접촉, 화학결합 접촉에 의해서 밀착되어 있다. To provide a measurement device for estimating thermal characteristics by using a unidirectional heat flow steady state comparison method, which can measure a value of contact thermal resistance of an object to be measured, a value of thermal resistance and thermal conductivity and can applies an adequate thermal measurement and analysis technology by an interface pressure dependency of the object to be measured, a technique for thermal contact and a heat-transfer promoting effect, and has high reliability.A measurement device 1 for estimating thermal characteristics comprises; a heat generating source unit 4 that has heat sensors 4gand 4gfor detecting heat radiating toward a measurement sample unit 5, and that heats the measurement sample unit 5; the measurement sample unit 5; and a heat cooling source unit 6 that has heat sensors 6cand 6cfor detecting heat radiating from the measurement sample unit 5, and that cools the measurement sample unit 5,wherein those units are sequentially stacked,the measurement sample unit 5 has a three-layer structure consisting of an object 5b to be measured for estimating thermal characteristics, and heat conducting materials 5a and 5c that sandwich the object,the heat conducting materials 5a and 5c are adhered to the heat generating source unit 4 and the heat cooling source unit 6 one another through a heat-transfer promoting agent therebetween,the object 5b to be measured for estimating thermal characteristics and the heat conducting materials 5a and 5c are adhered to one another through physical contact, chemical contact, and/or chemical bond contact.