adhesive composition and semiconductor wafer processing method using the same
The present invention relates to an adhesive composition and a semiconductor wafer processing method using the same. The adhesive composition is applied in a liquid form between a wafer substrate and an adhesive film and penetrates to a microscopic structure formed on an electronic circuit, and thus...
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Main Author | |
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Format | Patent |
Language | English Korean |
Published |
08.08.2019
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention relates to an adhesive composition and a semiconductor wafer processing method using the same. The adhesive composition is applied in a liquid form between a wafer substrate and an adhesive film and penetrates to a microscopic structure formed on an electronic circuit, and thus sufficiently fixes a wafer or a semiconductor chip. In addition, the adhesive composition is changed into a shape having elasticity during curing, so that peeling is easy and no residue of the adhesive is left on a wafer surface or the semiconductor chip, thereby preventing damage to the electronic circuit or the like.
본 발명은 점착제 조성물 및 이를 이용한 반도체 웨이퍼 가공방법에 관한 것으로서, 본 발명에서 제공되는 점착제 조성물은 웨이퍼 기판과 점착필름 사이에 액상의 형태로 도포되어 전자회로상에 형성되는 미시적 구조까지 침투되며, 이에 웨이퍼 또는 반도체 칩을 충분히 고정시킬 수 있으며, 경화 시 탄성을 갖는 형태로 변화되어 박리가 용이하며 웨이퍼 표면 또는 반도체 칩에 점착제의 잔사를 남기지 않아, 전자회로 등의 손상을 방지할 수 있다. |
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Bibliography: | Application Number: KR20190011737 |