SEMICONDUCTOR PACKAGE

A semiconductor package is provided. The semiconductor package includes: a lower package having a substrate and a lower semiconductor chip mounted on the substrate; an interposer substrate provided on the lower package; a first upper package and a second upper package mounted on the interposer subst...

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Bibliographic Details
Main Authors LEE KYOUNG MIN, IM YUNHYEOK, LEE KYUNGSOO, JANG HORANG
Format Patent
LanguageEnglish
Korean
Published 31.07.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package is provided. The semiconductor package includes: a lower package having a substrate and a lower semiconductor chip mounted on the substrate; an interposer substrate provided on the lower package; a first upper package and a second upper package mounted on the interposer substrate; and a heat transfer part disposed between the first upper package and the second upper package and isolating the first and second upper packages. The heat transfer part may be attached to the interposer substrate through first connection terminals. The heat dissipation efficiency of the semiconductor package can be increased. 기판 및 상기 기판에 실장되는 하부 반도체 칩을 갖는 하부 패키지, 상기 하부 패키지 상에 제공되는 인터포저 기판, 상기 인터포저 기판에 실장되는 제 1 상부 패키지와 제 2 상부 패키지, 및 상기 제 1 상부 패키지와 상기 제 2 상부 패키지 사이에 배치되어, 상기 제 1 및 제 2 상부 패키지들을 격리시키는 열 전달부를 포함하는 반도체 패키지를 제공하되, 상기 열 전달부는 제 1 연결 단자들을 통해 상기 인터포저 기판에 접착될 수 있다.
Bibliography:Application Number: KR20180008128