BRAZED JOINT AND SEMICONDUCTOR PROCESSING CHAMBER COMPONENT HAVING THE SAME

• Main Authors: WIDLOW LAN, CHO TOM K, RAJ GOVINDA, MOHIUDDIN HAMID
• Format: Patent
• Language: English; Korean
• Published: 29.07.2019
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

Disclosed are methods of forming a metallic-ceramic brazed joint. The method of forming a brazed joint comprises: a step of deoxidizing the surface of metallic components; a step of assembling the joint; a step of heating the joint to fuse the joint components; and a step of cooling the joint. In some embodiments, the brazed joint includes a conformal layer. In additional embodiments, the brazed joint has features to reduce stress concentration within the joint. 금속성-세라믹 브레이징 조인트(metallic-ceramic brazed joint)를 형성하는 방법들이 본원에서 개시된다. 브레이징 조인트를 형성하는 방법은, 금속성 컴포넌트들의 표면을 탈산시키는 단계, 조인트를 어셈블링하는 단계, 조인트 컴포넌트들을 융합시키기 위해 조인트를 가열하는 단계, 및 조인트를 냉각시키는 단계를 포함한다. 소정의 실시예들에서, 브레이징 조인트는 등각성의 층(conformal layer)을 포함한다. 추가의 실시예들에서, 브레이징 조인트는 조인트 내의 응력 집중들을 감소시키기 위한 피처(feature)들을 갖는다.