LOAD CUP AND CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME

• Main Authors: CHO GUI HYUN, CHOI YONG WON, EARMME TAE MIN, YOON DONG IL, HEO SEOK, SEO JONG HWI, YANG JI EUN
• Format: Patent
• Language: English; Korean
• Published: 21.06.2019
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

According to an embodiment of the present invention, provided is a load cup which comprises: a cup having an internal space; a pedestal installed in the internal space to be lifted up and down, and loading a wafer onto or unloading the wafer from a polishing head; and a plurality of arrangement parts having a plurality of fastening portions disposed around the pedestal, and moved horizontally in a direction of a center of the pedestal, and arrangement part bodies coupled to the fastening portions, respectively, and rotating or reciprocating to be in contact with a lateral surface of the polishing head and to adjust a center of the wafer to be aligned with a center of the polishing head. 본 발명의 일 실시예는, 내부공간을 갖는 컵; 상기 내부공간에 승하강 가능하게 설치되며, 웨이퍼를 연마 헤드에 로딩/언로딩하는 페데스탈(pedestal); 및 상기 페데스탈의 둘레에 배치되되 상기 페데스탈의 중심 방향으로 수평이동하는 복수의 체결부, 및 상기 복수의 체결부 상에 각각 결합되며 상기 연마 헤드의 측면에 접하도록 회전 운동 또는 왕복 운동하여 상기 웨이퍼의 중심을 상기 연마 헤드의 중심에 정렬되도록 조정하는 정렬부 몸체를 갖는 복수의 정렬부;를 포함하는 로드 컵을 제공한다.