SYSTEMS FOR INTEGRATED DECOMPOSITION AND SCANNING OF A SEMICONDUCTING WAFER

• Main Authors: HEIN JONATHAN, MARTH BEAU, KASER JARED, YOST TYLER, KIM JAE MIN, WIEDERIN DANIEL R, LEE JAE SEOK, SUDYKA STEPHEN H
• Format: Patent
• Language: English; Korean
• Published: 11.06.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Disclosed are a system and a method for integrated decomposition and scanning of a semiconductor wafer. Provided is a method for decomposing and scanning a surface of a semiconductor wafer utilizing a nozzle, comprising the steps of: spraying a decomposition fluid onto a surface of a semiconductor wafer with a nebulizer; positioning the nozzle above the surface of the semiconductor wafer; introducing a scan fluid to an inlet port of the nozzle and directing a stream of the scan fluid onto the surface of the semiconductor wafer via a first nozzle port; directing the stream of the scan fluid through an elongated channel of the nozzle along the surface of the semiconductor wafer toward a second nozzle port of the nozzle; and removing the stream of the scan fluid from the surface of the semiconductor wafer via the second nozzle port in fluid communication with an outlet port of the nozzle. 반도체 웨이퍼의 통합된 분해 및 스캐닝을 위한 시스템 및 방법이 개시되며, 단일 챔버가 관심 웨이퍼의 분해 및 스캐닝을 위해 이용된다.