POLYAMIDE RESIN RESIN COMPOSITION COMPRISING THE SAME AND MOLDED PRODUCTS FROM THE SAME

• Main Authors: LEE MYUNG OCK, KIM JI HYUN, PARK JAE YUN, HWANG YONG TAEK
• Format: Patent
• Language: English; Korean
• Published: 10.06.2019
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

The present invention relates to: a polyamide resin which is a copolymer of an aliphatic dicarboxylic acid and a diamine, wherein the diamine comprises at least one diamine mixture selected from a group consisting of an aliphatic diamine, an aromatic diamine, and an alicyclic diamine, and at least one of the aromatic diamine and the alicyclic diamine is contained in an amount ranging from 5 to 50 mol% of a diamine component of the polyamide resin; a composition comprising the same; and a molded article manufactured from the same. The present invention provides the polyamide resin having high strength, chemical resistance, and water absorption resistance, and having improved impact strength. 지방족 디카르복실산 및 디아민의 공중합체인 폴리아미드 수지로서, 상기 디아민은 지방족 디아민과 방향족 디아민 및 지환족 디아민 중 1종 이상의 디아민 혼합물을 포함하고, 상기 방향족 디아민 및 지환족 디아민 중 1종 이상은 상기 폴리아미드 수지의 디아민 성분 중 5몰% 내지 50몰%로 포함되는 폴리아미드 수지, 이를 포함하는 조성물 및 이로부터 제조된 성형품이 제공된다.