POLYOXYMETHYLENE RESIN COMPOSITION AND MOLDING INCULDING THE SAME

• Main Authors: CHA, SOON YOUNG, JEONG, KIE YOUN, KIM, HYEON CHEOL, SONG, JOON YONG, BAE, SHIN TAE, CHAE, HONG WON
• Format: Patent
• Language: English; Korean
• Published: 10.06.2019
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

A polyoxymethylene resin composition according to an embodiment of the present invention comprises 5 to 30 wt% of a filler, 0.01 to 1 wt% by of a formaldehyde reducing agent, and a polyoxymethylene resin as the remainder, wherein the polyoxymethylene resin comprises 30 to 40 μmol of terminal formate per 1g of the polyoxymethylene resin. The polyoxymethylene resin composition according to an embodiment of the present invention imparts reactivity to the end of a POM resin, thereby enhancing a bonding force with the filler. 본 발명의 일 실시예에 의한 폴리 옥시 메틸렌 수지 조성물은 충전재 5 내지 30 중량%, 포름알데히드 저감제 0.01 내지 1 중량% 및 잔부로 폴리 옥시 메틸렌 수지를 포함하고, 폴리 옥시 메틸렌 수지는 상기 폴리 옥시 메틸렌 수지 1g당 30 내지 40 μmol의 말단 포르메이트를 포함한다.