ELECTROMAGNETIC WAVE SHIELD FILM

An objective of the present invention is to realize an electromagnetic wave shielding film which optimizes the overall physical properties. To this end, the electromagnetic wave shielding film (101) comprises a conductive adhesive layer (111) and an insulating protection layer (112). The tension ela...

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Bibliographic Details
Main Authors AOYAGI YOSHIHIKO, KAMINO KENJI, YAMAUCHI SIROU
Format Patent
LanguageEnglish
Korean
Published 29.05.2019
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:An objective of the present invention is to realize an electromagnetic wave shielding film which optimizes the overall physical properties. To this end, the electromagnetic wave shielding film (101) comprises a conductive adhesive layer (111) and an insulating protection layer (112). The tension elasticity modulus of the electromagnetic wave shielding film (101) is higher than 400 MPa, and the rupture elongation is higher than or equal to 3%. 본 발명은 전체적인 물성을 최적화한 전자파 차폐 필름을 실현할 수 있게 하는 것을 과제로 한다. 상기 과제를 해결하기 위하여, 본 발명의 전자파 차폐 필름(101)은, 도전성 접착제층(111)과 절연 보호층(112)을 구비하고 있다. 전자파 차폐 필름(101)의 인장 탄성율은 400MPa 이상이며, 파단 신도는 3% 이상이다.
Bibliography:Application Number: KR20180081284