SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

• Main Authors: LEE EUN JUNG, LEE YOUNG JOON, BAE KYOUNG CHUL
• Format: Patent
• Language: English; Korean
• Published: 09.05.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention is to provide a semiconductor package excellent in electromagnetic wave shielding performance and interfacial adhesion. The present invention relates to a semiconductor package and a method for manufacturing the same. According to the present invention, the semiconductor packag...