SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

• Main Authors: LEE EUN JUNG, LEE YOUNG JOON, BAE KYOUNG CHUL
• Format: Patent
• Language: English; Korean
• Published: 09.05.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention is to provide a semiconductor package excellent in electromagnetic wave shielding performance and interfacial adhesion. The present invention relates to a semiconductor package and a method for manufacturing the same. According to the present invention, the semiconductor package comprises: a substrate on which at least one semiconductor chip is mounted; a first sealing layer sealing the semiconductor chip; a conductive sheet provided on the substrate and the first sealing layer and the substrate, and having a plurality of cavities; and a second sealing layer formed on the conductive sheet. 본 발명은 적어도 하나 이상의 반도체 칩이 실장된 기판; 상기 반도체 칩을 밀봉하는 제1밀봉층; 상기 기판 및 제1밀봉층 상에 구비되며, 다수의 공극(Cavity)을 갖는 전도성 시트; 및 상기 전도성 시트 상에 형성되는 제2밀봉층을 포함하는 반도체 패키지 및 그 제조 방법에 관한 것이다.