LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

• Main Authors: JEONG YOUNG KYU, JEONG HWAN HEE, LEE GUN KYO
• Format: Patent
• Language: English; Korean
• Published: 08.04.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention provides a light emitting device package with increased light extraction efficiency. According to an embodiment of the present invention, the light emitting device package comprises: a light emitting device arranged on a lower surface of a light emitting structure and including a first electrode pad and a second electrode pad; and a wavelength conversion layer arranged on an upper surface and a lateral surface of the light emitting device. The first electrode pad and the second electrode pad are extended in a lower part of the wavelength conversion layer and the wavelength conversion layer includes an inorganic material and a wavelength conversion particle diffused to the inorganic material. 실시 예는, 발광 구조물의 하면에 배치되는 제1전극패드 및 제2전극패드를 포함하는 발광소자; 및 상기 발광소자의 상면과 측면에 배치되는 파장변환층을 포함하고, 상기 제1전극패드 및 상기 제2전극패드는 상기 파장변환층의 하부로 연장되고, 상기 파장변환층은 무기물, 및 상기 무기물에 분산된 파장변환입자를 포함하는 발광소자 패키지를 개시한다.