FINGERPRINT RECONGNITION PACKAGE AND MANUFACTURING METHOD THEREOF

Various embodiments related to a fingerprint recognition package have been described, and according to one embodiment, the fingerprint recognition package comprises: a circuit board; an image sensor die attached to the circuit board and electrically connected thereto; a light shielding member applie...

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Bibliographic Details
Main Authors PARK TAE SANG, LEE KYO REE, KIM SEONG JUN, LEE TACK MO, KIM MI JIN
Format Patent
LanguageEnglish
Korean
Published 03.04.2019
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:Various embodiments related to a fingerprint recognition package have been described, and according to one embodiment, the fingerprint recognition package comprises: a circuit board; an image sensor die attached to the circuit board and electrically connected thereto; a light shielding member applied to the circuit board; and an adhesive member attached to one surface of the light shielding member. Various other embodiments are possible. An objective of the present invention is to simplify the manufacturing process of the fingerprint recognition package, and to provide the fingerprint recognition package with a miniaturized or thin shape. 지문인식 패키지와 관련된 다양한 실시예들이 기술된 바, 한 실시예에 따르면, 지문인식 패키지는, 회로기판; 상기 회로 기판에 부착됨과 아울러 전기적으로 연결되는 이미지 센서 다이; 상기 회로 기판에 도포되는 차광 부재; 및 상기 차광 부재의 일면에 부착되는 접착 부재를 포함할 수 있으며, 이외에도 다양한 다른 실시예들이 가능하다.
Bibliography:Application Number: KR20170123573