입자 코팅 장치 및 방법

• Main Authors: SILBERNAGEL DANIEL, STREGE STEFAN, LIEBSCH TILLMANN, KLEINE JAEGER FRANK
• Format: Patent
• Language: Korean
• Published: 27.03.2019
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

본 발명은 (a) 입자를 제 1 반응성 가스와 접촉시킬 수 있는 제 1 반응기 및 (b) 입자를 제 2 반응성 가스와 접촉시킬 수 있는 제 2 반응기를 포함하는 원자층 침착에 의한 입자 코팅 장치에 관한 것으로, 이때 상기 제 1 및 제 2 반응기는 제 1 및 제 2 가스 락에 의해 분리되고, 상기 입자는 상기 제 1 반응기로부터 상기 제 1 가스 락을 통해 제 2 반응기로 이송될 수 있으며, 동시에 상기 입자는 제 2 반응기로부터 제 2 가스 락을 통해 제 1 반응기로 이송될 수 있다. The present invention relates to an apparatus for coating particles by atomic layer deposition comprising (a) a first reactor capable of bringing particles in contact with a first reactive gas and (b) a second reactor capable of bringing particles in contact with a second reactive gas, wherein the first and the second reactor are separated by a first and a second gas lock and the particles can be conveyed from the first reactor through the first gas lock to the second reactor and at the same time the particles can be conveyed from the second reactor through the second gas lock to the first reactor.