IMAGE SENSOR MODULE

According to one embodiment of the present invention, provided is an image sensor module comprising a lower structure, and an upper structure disposed on the lower structure and having a semiconductor substrate with an image sensor formed thereon. The lower structure comprises: reinforcing frames di...

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Bibliographic Details
Main Author LEE, SHLE GE
Format Patent
LanguageEnglish
Korean
Published 20.03.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:According to one embodiment of the present invention, provided is an image sensor module comprising a lower structure, and an upper structure disposed on the lower structure and having a semiconductor substrate with an image sensor formed thereon. The lower structure comprises: reinforcing frames disposed along the edge of the lower surface of the upper structure; a semiconductor chip disposed between the reinforcing frames and connected to the image sensor; and a resin molding part disposed between the reinforcing frames and the semiconductor chip, wherein the reinforcing frames have a Young modulus greater than that of the resin molding part. 본 발명의 일 실시예는, 하부 구조체와, 상기 하부 구조체 상에 배치되며 이미지 센서가 형성된 반도체 기판을 갖는 상부 구조체를 포함하고, 상기 하부 구조체는, 상기 상부 구조체의 하면의 모서리를 따라 배치된 보강 프레임과, 상기 보강 프레임 사이에 배치되며 상기 이미지 센서와 연결된 반도체 칩과, 상기 보강 프레임과 상기 반도체 칩 사이에 배치된 수지 몰딩부를 포함하며, 상기 보강 프레임은 상기 수지 몰딩부보다 큰 영률(Young modulus)을 갖는 이미지 센서 모듈을 제공한다.
Bibliography:Application Number: KR20170116396