ETCHING FOR BONDING POLYMER MATERIAL TO ANODIZED METAL

• Main Authors: MISRA ABHIJEET, HAMANN ERIC W, CURRAN JAMES A, MINTZ TODD S, ZHANG SHI HUA, YANG ISABEL
• Format: Patent
• Language: English; Korean
• Published: 18.03.2019
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PERFORMING OPERATIONS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

The present invention relates to a multi-piece enclosure for a portable electronic device. The enclosure includes a metal part including a metal substrate and a metal oxide layer overlaying the metal substrate, the metal oxide layer having an external surface that includes openings that lead into undercut regions. The openings are characterized as having a first width, and the undercut regions are characterized as having a second width that is greater than the first width. The enclosure further includes a non-metallic bulk layer including protruding portions that extend into the undercut regions such that the non-metallic bulk layer is interlocked with the metal part. 본 출원은 휴대용 전자 디바이스를 위한 멀티-피스 인클로저(multi-piece enclosure)에 관한 것이다. 인클로저는 금속 기판 및 금속 기판을 오버레이하는 금속 산화물 층을 포함하는 금속 부품을 포함하며, 금속 산화물 층은 언더컷 영역 내로 이어지는 개구를 포함하는 외부 표면을 갖는다. 개구는 제1 폭을 갖는 것으로 특징지어지고, 언더컷 영역은 제1 폭보다 더 큰 제2 폭을 갖는 것으로 특징지어진다. 인클로저는 비금속 벌크 층을 추가로 포함하며, 비금속 벌크 층은 금속 부품과 인터로킹되도록 언더컷 영역 내로 연장되는 돌출 부분을 포함한다.