에폭시 수지 조성물, 프리프레그 및 섬유 강화 복합 재료

• Main Authors: SANO KENTARO, KURODA TAIKI, TAKAIWA REO, HIRANO NORIYUKI
• Format: Patent
• Language: Korean
• Published: 06.03.2019
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

높은 내열성 및 탄성율과 낮은 착색성을 양립하는 에폭시 수지 경화물이 얻어지는 한편 섬유 강화 복합 재료의 매트릭스 수지로서 이용했을 때에 성형품 표면에 백색 석출물이 생기지 않고, 뛰어난 외관을 가지는 에폭시 수지 조성물을 제공한다. 성분［A］로서 에폭시 수지, 성분［B］로서［B1］방향족 우레아 및/또는［B2］이미다졸 화합물 및 성분［C］로서 붕산 에스테르 화합물을 포함하고, 디시안디아미드의 함유량이 전체 에폭시 수지 100질량부에 대해 0.5질량부 이하이며, 또한 하기＜i＞또는＜ii＞를 만족하는 에폭시 수지 조성물. ＜i＞이하의 조건(a), 조건(b) 및 조건(c)을 만족한다. ＜ii＞이하의 조건(d) 및 조건(e)을 만족한다. (a): 성분［A］로서［A1］이소아눌산형 에폭시 수지를, 전체 에폭시 수지 100 질량부 중 10 ~ 40 질량부 포함한다. (b): 성분［A］로서［A2］비스페놀형 에폭시 수지를, 전체 에폭시 수지 100 질량부 중 40 ~ 90 질량부 포함한다. (c): ［A2］의 평균 에폭시 당량은 220 ~ 500 g/eq이다. (d): 성분［A］로서［A3］ 일반식(I)로 나타나는 에폭시 수지를 전체 에폭시 수지 100 질량부 중 50 ~ 100질량부 포함한다. (e): 전체 에폭시 수지의 평균 에폭시 당량은 165 ~ 265 g/eq이다. The present invention provides an epoxy resin composition that serves to produce a cured epoxy resin that simultaneously realizes a high heat resistance, a high elastic modulus, and a low color and to produce a molded article having a good appearance without suffering the formation of white spots on the surface thereof when used as matrix resin in a fiber reinforced composite material. An epoxy resin composition including an epoxy resin as component [A], an aromatic urea [B1] and/or an imidazole compound [B2] as component [B], and a borate ester compound as component [C], containing dicyandiamide in the amount of 0.5 part by mass or less relative to the total quantity of epoxy resins which accounts for 100 parts by mass, and meeting the requirement or given below: meeting the condition (a), condition (b), and condition (c) given below, meeting the condition (d) and condition (e) given below, (a) an isocyanurate type epoxy resin [A1] is contained as component [A] in an amount of 10 to 40 parts by mass relative to the total quantity of epoxy resins which represents 100 parts by mass, (b) an bisphenol type epoxy resin [A2] is contained as component [A] in an amount of 40 to 90 parts by mass relative to the total quantity of epoxy resins which represents 100 parts by mass, (c) resin [A2] has an average epoxy equivalent weight of 220 to 500 g/eq, and (d) an epoxy resin [A3] as represented by specific general formula is contained as component [A] in an amount of 50 to 100 parts by mass relative to the total quantity of epoxy resins which represents 100 parts by mass, and (e) the average epoxy equivalent weight over all epoxy resins is 165 to 265 g/eq.