FILM BONDING METHOD OF ELECTRONIC COMPONENTS FORMING AND SEPERATING METHOD OF FILM AND ELECTROCONDUCTIVE BONDING MATERIAL

• Main Authors: UESHIMA MINORU, OHSAWA ISAMU
• Format: Patent
• Language: English; Korean
• Published: 19.02.2019
• Subjects: ALLOYS; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; CLADDING OR PLATING BY SOLDERING OR WELDING; CONDUCTORS; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRICITY; FERROUS OR NON-FERROUS ALLOYS; INSULATORS; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; PERFORMING OPERATIONS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SOLDERING OR UNSOLDERING; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; WELDING; WORKING BY LASER BEAM

유리나 세라믹스 등의 무기 비금속과의 접착 강도가 높고, 고온에 노출되어도 박리가 일어나지 않는 신뢰성이 우수한 도전성 밀착 재료는, 질량％로, Zn:0.1∼15％, In:2∼16％, Sb:0％ 초과 2％ 이하, 또한 경우에 따라 Ag:2％ 이하와 Cu:1％ 이하의 한쪽 또는 양쪽, Ba, Ti 및 Ca로 이루어지는 군에서 선택되는 적어도 1종을 합계로 0.01∼0.15％ 함유하고, 잔량부 Sn이라고 하는 합금 조성을 갖는다. 이 도전성 밀착 재료는, 융점 이상으로 가열함으로써 박리하여 재이용 가능하다. An electroconductive bonding material which has a high bonding strength to an inorganic nonmetal such as glass or a ceramic and which has excellent reliability in that it does not undergo peeling even when exposed to a high temperature has an alloy composition which comprises, in mass %, Zn: 0.1 - 15 %, In: 2 - 16 %, Sb: greater than 0 % to at most 2 %, optionally one or both of Ag: at most 2 % and Cu: at most 1 %, optionally at least one element selected from the group consisting of Ba, Ti, and Ca in a total amount of 0.01 - 0.15 %, and a remainder of Sn. This electroconductive bonding material peels off when it is heated to at least its melting point and can be reused.