IMPROVED THERMAL PROCESSING WITH LINE BEAMS

• Main Authors: KENNEDY KEITH W, MARTINSEN ROBERT. J, KARLSEN SCOTT R
• Format: Patent
• Language: English; Korean
• Published: 19.02.2019
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTROGRAPHY; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUSMETALS OR ALLOYS; HOLOGRAPHY; MACHINE TOOLS; MAKING METAL MALLEABLE BY DECARBURISATION, TEMPERING OR OTHERTREATMENTS; MATERIALS THEREFOR; METAL-WORKING NOT OTHERWISE PROVIDED FOR; METALLURGY; METALLURGY OF IRON; MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

다중 빔, 다중 파장 처리 시스템은 기판에 각각의 빔들을 제공하도록 구성된 두 개 이상의 레이저들을 포함한다. 빔들은 파장들, 펄스 지속 시간들, 빔 영역들, 빔 강도들, 펄스 에너지들, 편광들, 반복율 및 독립적으로 선택할 수 있는 다른 빔 속성들을 포함한다. 국부적 가열을 필요로하는 공정에서 기판의 변형은 제 1 파장에서 큰 영역의 빔을 이용하여 먼저 가열하고, 원하는 공정 온도로 국부적 영역을 가열하기 위해, 제 2 파장에서 포커싱된 빔에 노광됨으로써 감소될 수 있다. 일부 처리 과정을 위해, 다중 파장들은 기판 내에서 원하는 에너지 증착을 획득하도록 선택된다. Multi-beam, multi-wavelength processing systems include two or more lasers configured to provide respective beams to a substrate. The beams have wavelengths, pulse durations, beam areas, beam intensities, pulse energies, polarizations, repetition rates, and other beam properties that are independently selectable. Substrate distortion in processes requiring local heating can be reduced by preheating with a large area beam at a first wavelength followed by exposure to a focused beam at a second wavelength so as to heat a local area to a desired process temperature. For some processing, multiple wavelengths are selected to obtain a desired energy deposition within a substrate.