DIE BONDING APPARATUS

• Main Authors: BANG, HO CHEON, JEON, BYOUNG HO
• Format: Patent
• Language: English; Korean
• Published: 29.01.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A die bonding apparatus is disclosed. The die bonding apparatus includes: a bonding module bonding dies on a wafer; a load port supporting a container containing a plurality of wafers; a wafer alignment unit for aligning the wafer; a first wafer transfer module transferring the wafer between the con...