METHOD OF STICTION PREVENTION BY PATTERNED ANTI-STICTION LAYER
The present invention relates to a MEMS device having a patterned anti-adhesion layer and a related forming method. The MEMS device has a handle substrate defining a first bonding surface, and a MEMS substrate having the MEMS device defining a second bonding surface. The handle substrate is bonded t...
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Main Authors | , , , |
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Format | Patent |
Language | English Korean |
Published |
09.01.2019
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention relates to a MEMS device having a patterned anti-adhesion layer and a related forming method. The MEMS device has a handle substrate defining a first bonding surface, and a MEMS substrate having the MEMS device defining a second bonding surface. The handle substrate is bonded to the MEMS substrate through a bonding interface with the first bonding surface facing the second bonding surface. The anti-adhesion layer does not sit on the bonding interface but is arranged between the first bonding surface and the second bonding surface.
본 개시는 패터닝된 점착방지층을 갖는 MEMS 장치 및 연관된 형성 방법에 관한 것이다. MEMS 장치는 제 1 본딩면을 규정하는 핸들 기판, 및 MEMS 디바이스를 갖고 제 2 본딩면을 규정하는 MEMS 기판을 갖는다. 핸들 기판은 제 1 본딩면이 제 2 본딩면을 향하는 상태에서 본딩 계면을 통해 MEMS 기판에 본딩된다. 점착방지층은 본딩 계면 위에는 상주하지 않고 제 1 본딩면과 제 2 본딩면 사이에 배열된다. |
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Bibliography: | Application Number: KR20170124139 |