열경화성 수지 조성물, 경화막, 경화막 부착 기판 및 전자 부품

• Main Authors: FURUTA TOMOTSUGU, KIKUCHI AYAKO
• Format: Patent
• Language: Korean
• Published: 21.12.2018
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

고경도, 고투명성, 유리나 ITO에 대한 밀착성을 가지는 경화막을 형성할 수 있는 열경화성 수지 조성물, 및 그 용도를 제공한다. 열경화성 수지 조성물은, 폴리에스테르아미드산(A), 플루오렌 골격 또는 디시클로펜타디엔 골격을 가지는 에폭시 화합물(B), 에폭시 경화제(C), 용매(D), 평균 입자 직경이 50nm 이하인 실리카 미립자(E) 및 광학 조정 에폭시 수지(F)를 포함하고 있으므로, 고경도, 고투명성, 유리나 ITO에 대한 밀착성을 가지는, 밸런스가 양호한 경화막을 형성할 수 있다. Provided are a thermosetting resin composition capable of forming a cured film having high hardness, high transparency, and adhesion to glass or ITO, and an application for the same. The thermosetting resin composition according to the present invention includes a polyester amide acid (A), an epoxy compound (B) having a fluorene skeleton or a dicyclopentadiene skeleton, an epoxy curing agent (C), a solvent (D), silica fine particles (E) having an average particle diameter of 50 nm or less, and an optical adjustment epoxy resin (F), and therefore can form a well-balanced cured film having high hardness, high transparency, and adhesion to glass or ITO.