POLISHING MATERIAL AND POLISHING COMPOSITION

• Main Authors: TAMAI KAZUSEI, ISHIBASHI TOMOAKI, YAMADA EIICHI, TAKAHASHI YOUHEI, ISHIHARA NAOYUKI, MORINAGA HITOSHI, OTSU TAIRA
• Format: Patent
• Language: English; Korean
• Published: 19.12.2018
• Subjects: ADHESIVES; CHEMISTRY; DRESSING OR CONDITIONING OF ABRADING SURFACES; DYES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PERFORMING OPERATIONS; POLISHES; POLISHING; POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES; TRANSPORTING

본 발명은 연마재 및 물을 함유하는 연마용 조성물을 제공한다. 연마용 조성물 중 연마재의 함유량은 0.1 질량％ 이상이다. 연마재는 산화지르코늄 입자를 함유한다. 산화지르코늄 입자는 1 내지 15 m/g의 비표면적을 갖는다. 산화지르코늄 입자는 99 질량％ 이상의 순도를 갖는 것이 바람직하다. 연마용 조성물은 사파이어, 질화규소, 탄화규소, 산화규소, 유리, 질화갈륨, 비화갈륨, 비화인듐, 인화인듐 등의 경취 재료를 연마하는 용도에서 예를 들면 사용된다. Provided is a polishing composition containing an abrasive and water. The abrasive content in the polishing composition is no less than 0.1% by mass. The abrasive contains zirconium oxide particles. The zirconium oxide particles have a specific surface area of from 1 to 15 m 2 /g. The zirconium oxide particles preferably have a purity of no less than 99% by mass. The polishing composition is used in, for example, polishing a hard and brittle material, such as sapphire, silicon nitride, silicon carbide, silicon oxide, glass, gallium nitride, gallium arsenide, indium arsenide, and indium phosphide.