HIGH PRESSURE-RESIN TRANSFER MOLDING USING A SINGLE LOWER MOLD

• Main Authors: CHOI, SHEONG HYUN, JO, MIN CHANG, KIM, HEE JUNE, LEE, WOO JU, MOON, JOO YONG, PARK, SAT BYEOL
• Format: Patent
• Language: English; Korean
• Published: 19.12.2018
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; MAKING GRANULES OR PREFORMS; PERFORMING OPERATIONS; PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Disclosed is a high pressure-resin transfer molding method using a single lower mold. The high pressure-resin transfer molding method according to the present invention includes the following steps: (a) horizontally moving a lower mold containing a preform to a lower position of a cutting device, and cutting the preform; and (b) moving the lower mold to a lower position of a molding device, and injecting a resin into a resin injection port provided in the molding device to impregnate the preform with the resin. The step (a) and (b) are performed through one lower mold. 단일 하금형을 이용한 고압수지 이송성형 방법에 대하여 개시한다. 본 발명에 따른 고압수지 이송성형 방법은 (a) 프리폼이 수용된 하금형을 재단장치 하부 위치로 수평 이동시켜, 상기 프리폼을 재단하는 단계; 및 (b) 상기 하금형이 성형장치 하부 위치로 이동하고, 성형장치에 구비된 수지 주입구에 수지를 주입하여 프리폼에 수지를 함침시키는 단계;를 포함하고, 상기 (a) ~ (b) 단계는 단일 하금형을 이용하여 수행되는 것을 특징으로 한다.