수지 조성물 및 다층 기판

• Main Authors: BABA SUSUMU, HAYASHI TATSUSHI
• Format: Patent
• Language: Korean
• Published: 28.11.2018
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

디스미어성을 높일 수 있고, 경화물의 유전 정접을 낮출 수 있으며, 경화물의 내열성을 높일 수 있는 수지 조성물을 제공한다. 본 발명에 따른 수지 조성물은 식 (1)로 표시되는 구조, 식 (1)로 표시되는 구조에 있어서의 벤젠환에 치환기가 결합한 구조, 식 (2)로 표시되는 구조, 식 (2)로 표시되는 구조에 있어서의 벤젠환에 치환기가 결합한 구조, 식 (3)으로 표시되는 구조, 식 (3)으로 표시되는 구조에 있어서의 벤젠환에 치환기가 결합한 구조, 식 (4)로 표시되는 구조, 또는 식 (4)로 표시되는 구조에 있어서의 벤젠환에 치환기가 결합한 구조를 갖는 화합물과, 활성 에스테르 화합물을 포함하고, 상기 식 (1), (2), (3) 또는 (4)로 표시되는 구조는, 페닐렌기 또는 나프틸렌기 및 헤테로 원자, 헤테로 원자에 수소 원자가 결합한 기 또는 카르보닐기를 갖는다. There is provided a resin composition with which the desmear properties can be enhanced, a cured product thereof can be made low in dielectric loss tangent, and the cured product can be made high in heat resistance. The resin composition according to the present invention includes a compound having a structure represented by formula (1), a structure in which a substituent is bonded to a benzene ring in the structure represented by formula (1), a structure represented by formula (2), a structure in which a substituent is bonded to a benzene ring in the structure represented by formula (2), a structure represented by formula (3), a structure in which a substituent is bonded to a benzene ring in the structure represented by formula (3), a structure represented by formula (4), or a structure in which a substituent is bonded to a benzene ring in the structure represented by formula (4) and an active ester compound and the structure represented by the formula (1), (2), (3), or (4) has a phenylene group or a naphthylene group and a hetero atom, a group in which a hydrogen atom is bonded to a hetero atom, or a carbonyl group.