열경화성 조성물

• Main Authors: TSUNO SHINGO, OKUNO HIROKO, OHKUBO MAKOTO
• Format: Patent
• Language: Korean
• Published: 27.11.2018
• Subjects: ADHESIVES; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CORRECTING FLUIDS; DYES; FILLING PASTES; GENERAL PROCESSES OF COMPOUNDING; INKS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS THEREFOR; WOODSTAINS; WORKING-UP

우수한 진동 저감 특성을 가지며, 고온에서 가열하여도 강도 저하가 적은 열경화성 조성물이 제공된다. 상기 열경화성 조성물은 (a1) 고형 고무, (a2) 22 ℃에서 액상 또는 페이스트상인 올레핀 이중 결합-함유 중합체, (a3) 조성물의 총 중량을 기준으로 0 내지 22 중량%의 양의 탄화수소 수지, 및 (a4) 액상 폴리디엔을 포함하는 성분 (a); 및 (b1) 조성물의 총 중량을 기준으로 1 내지 3 중량%의 양의 황, 및 (b2) 조성물의 총 중량을 기준으로 0 내지 0.2 중량%의 양의 유기 가황제를 포함하는 성분 (b)를 포함한다. A thermally curable composition having excellent vibration damping properties, and having a small decrease in strength even if heated at high temperature is provided. The thermally curable composition contains a component (a) comprising (a1) a solid rubber, (a2) an olefinic double bond-containing polymer which is liquid or pasty at 22° C., (a3) a hydrocarbon resin in an amount of 0 to 22% by weight based on the total weight of the composition, and (a4) a liquid polydiene; and a component (b) comprising (b1) sulfur in an amount of 1 to 3% by weight based on the total weight of the composition, and (b2) an organic vulcanizing agent in an amount of 0 to 0.2% by weight based on the total weight of the composition.