웨이퍼 가공용 테이프

• Main Authors: AKUTSU AKIRA, OTA SATOSHI
• Format: Patent
• Language: Korean
• Published: 07.11.2018
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

프리컷 가공된 웨이퍼 가공용 테이프를 롤 상태에서 보관하였을 때, 라벨부가 웨이퍼 가공용 테이프의 배면과 블로킹하는 것을 억제하고, 롤 상태로부터 라벨부를 양호하게 조출할 수 있는 웨이퍼 가공용 테이프를 제공한다. 장척의(긴) 이형 필름(11)과, 이형 필름(11)의 제1 면(11a) 상에 설치된 링 프레임(R)에 대응하는 소정 형상을 갖는 라벨부(12a)와, 라벨부(12a)의 외측을 둘러싸는 주변부(12b)를 갖는 점착 필름(12)과, 이형 필름(11)의 짧은 변 방향 양단부이며, 점착 필름(12)이 설치된 제1 면(11a)과는 반대인 제2 면(11b) 상에 설치된 지지 부재(13)를 갖고, 점착 필름(12)은 이형 필름(11)에 접촉하고 있지 않은 측의 산술 표면 조도 Ra가 0.3㎛ 이하이고, 지지 부재(13)는 두께가 30 내지 150㎛인 것을 특징으로 한다. Provided is a wafer processing tape that is capable of excellently delivering a label part from a rolled state by suppressing blocking of the label part with the back surface of the wafer processing tape when the wafer processing tape that has been precut is stored in a rolled state. The present invention is characterized by having: a long release film 11; an adhesive film 12 that has a label part 12a having a prescribed shape corresponding to a ring frame R provided on a first surface 11a of the release film 11, and peripheral parts 12b surrounding the outside of the label part 12a; and support members 13 that are provided on both ends of the release film 11 in a short direction and on a second surface 11b opposed to the first surface 11a on which the adhesive film 12 is provided, wherein the arithmetic surface roughness Ra of the adhesive film 12 on the side not in contact with the release film 11 is equal to or less than 0.3 μm, and the thickness of each of the support members 13 is 30-150 μm.