Photosensitive resin composition and electronic device comprising cured product of composition for forming pattern comprising the same

• Main Authors: SONG, IN SEOK, KIM, SU JEONG, LEE, YUI KU
• Format: Patent
• Language: English; Korean
• Published: 19.10.2018
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

The present invention relates to a photosensitive resin composition which includes a first binder resin and a second binder resin, wherein the weight average molecular weight of the first binder resin and the second binder resin is 7,000 to 12,000 g/mol. The present invention also relates to an electronic device which comprises a cured product of a composition for forming a pattern including the photosensitive resin composition. An objective of the present invention is to provide a photosensitive resin composition which can be cured at a low temperature. 본 발명은 제1 바인더 수지 및 제2 바인더 수지를 포함하고, 상기 제1 바인더 수지 및 제2 바인더 수지의 중량 평균 분자량은 7,000 g/mol 내지 12,000 g/mol 인 감광성 수지 조성물 및 이를 포함한 패턴 형성용 조성물의 경화물을 포함하는 전자 장치에 관한 것이다.