THERMAL SPRAY SLURRY AND METHOD OF FORMING THERMAL SPRAYED COAT

• Main Authors: IBE HIROYUKI, MASUDA TAKAYA, SUGIMURA KAZUYA
• Format: Patent
• Language: English; Korean
• Published: 01.10.2018
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The present invention provides thermal spray slurry capable of forming a thermal sprayed coating having high adhesion strength on a thermal spray target surface of a substrate. The thermal spray slurry forms a thermal sprayed coating on the thermal spray target surface by spraying the thermal spray slurry on the thermal spray target surface of the substrate, the thermal spray slurry containing: thermal spray particles having a 50% particle diameter D50 equal to or larger than 1 μm and equal to or smaller than 5 μm in volume-based cumulative particle diameter distribution; and a dispersion medium in which the thermal spray particles are dispersed. In addition, a ratio D10/Ra between a surface roughness Ra (unit: μm) of the thermal spray target surface and a 10% particle diameter D10 (unit: μm) of the thermal spray particles in the volume-based cumulative particle diameter distribution satisfies a formula 0.4 < D10/Ra <= 0.9. 본 발명은, 기재의 피용사면에 대한 밀착 강도가 높은 용사 피막을 형성 가능한 용사용 슬러리를 제공한다. 용사용 슬러리는, 기재의 피용사면에 용사하여 피용사면 상에 용사 피막을 형성하기 위한 것이며, 체적 기준의 적산 입자 직경 분포에 있어서의 50％ 입자 직경 D50이 1㎛ 이상 5㎛ 이하인 용사 입자와, 해당 용사 입자가 분산된 분산매를 함유한다. 그리고, 피용사면의 표면 조도 Ra(단위는 ㎛)와, 용사 입자의 체적 기준의 적산 입자 직경 분포에 있어서의 10％ 입자 직경 D10(단위는 ㎛)의 비 D10/Ra가 하기 식을 만족시킨다. 0.4＜D10/Ra≤0.9