도전 재료 및 접속 구조체

• Main Authors: NATSUI HIROSHI, ISHIZAWA HIDEAKI, ITOU MASAHIRO, YASUI HIDEFUMI, SADANAGA SHUUJIROU
• Format: Patent
• Language: Korean
• Published: 27.09.2018
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CONDUCTORS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

보존 안정성이 높고, 접속 대상 부재 상에 도전 재료가 배치된 후, 장시간 방치되어도 우수한 땜납 응집성을 나타내는 점에서, 높은 도통 신뢰성을 발현할 수 있는 도전 재료를 제공한다. 본 발명에 따른 도전 재료는, 도전부의 외표면 부분에, 땜납을 갖는 복수의 도전성 입자와, 열경화성 성분과, 플럭스를 포함하고, 상기 플럭스가 산과 염기의 염이고, 25℃의 도전 재료 중에서, 상기 플럭스가 고체로 존재한다. Provided is a conductive material capable of providing high conduction reliability since the conductive material has high storage stability, and shows, after being arranged on a member to be connected, excellent solder cohesiveness performance, even if being left for a long time. The conductive material according to the present invention contains, in the outer surface portion of a conductive portion: a plurality of conductive particles having solder; a thermosetting component; and flux. The flux is a salt of an acid and a base. The flux is present as a solid in the conductive material at 25°C.