Surface treated copper foiland current collectorelectrodeand battery using the surface treated copper foil

• Main Authors: ARAI HIDETA, MIKI ATSUSHI
• Format: Patent
• Language: English; Korean
• Published: 13.08.2018
• Subjects: APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY

The present invention provides a surface treated copper foil for a battery in which falling of roughened particles is less and which can obtain good adhesion with an active material. The surface treated copper foil for a battery of the present invention comprises: a copper foil; and a surface treated layer on at least one surface of the copper foil. The surface treated layer has a primary particle layer and a secondary particle layer. A surface of the surface treated layer has a 10-point average roughness (Rz) of 1.8 μm or more when measuring by using a laser microscope with a wavelength of 405 nm based on JIS B0601 1994. [과제] 조화 입자의 탈락이 적고, 활물질과의 양호한 밀착성을 얻을 수 있는 전지용 표면 처리 동박을 제공한다. [해결 수단] 본 발명의 전지용 표면 처리 동박은, 동박 및 상기 동박의 적어도 일방의 표면 측에 표면 처리층을 가지고, 상기 표면 처리층은 1차 입자층, 2차 입자층을 가지며, 상기 표면 처리층 표면을 JIS　B0601　1994에 준거하여, 파장 405nm의 레이저 현미경을 이용해서 측정했을 때의 10점 평균 조도(Rz)가 1.8㎛ 이상인 전지용 표면 처리 동박이다.