RESIN VARNISH PREPREG LAMINATE AND PRINTED WIRING BOARD

• Main Authors: KANEKO TATSUNORI, KAKITANI MINORU, SHIRAOKAWA YOSHIKATSU, SHIMIZU HIROSHI, KUSHIDA KEISUKE
• Format: Patent
• Language: English; Korean
• Published: 11.07.2018
• Subjects: ADHESIVES; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CORRECTING FLUIDS; DYES; FILLING PASTES; INKS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PERFORMING OPERATIONS; POLISHES; TRANSPORTING; USE OF MATERIALS THEREFOR; WOODSTAINS

고내열성, 저비유전율, 높은 금속박 접착성, 고유리 전이 온도 및 저열 팽창성을 가지면서, 또한 성형성 및 도금 퍼짐성이 우수한 열 경화성 수지 조성물을 사용한, 수지 바니시, 프리프레그, 적층판 및 프린트 배선판을 제공한다. 상기 수지 바니시는, 구체적으로는 (A) 말레이미드 화합물, (B) 에폭시 수지, (C) 방향족 비닐 화합물에서 유래하는 구조 단위와 무수 말레산에서 유래하는 구조 단위를 갖는 공중합 수지, (D) 아미노실란계 커플링제로 처리된 실리카 및 (G) 유기 용제를 함유하는 수지 바니시이다. The present invention provides a resin varnish, a prepreg, a laminate and a printed wiring board, using a thermosetting resin composition having high heat resistance, low relative permittivity, high metal foil adhesion, high glass transition temperature and low thermal expansion and excellent in moldability and platability. Specifically, the resin varnish contains (A) a maleimide compound, (B) an epoxy resin, (C) a copolymer resin having a structural unit derived from an aromatic vinyl compound and a structural unit derived from a maleic anhydride, (D) a silica treated with an aminosilane coupling agent, and (G) an organic solvent.